^ all PCI-E 2.0??
hope they come up with PCI-E 3.0 for more future proof.

It was pointed out that there could be a possibility that BD was never delayed and it is 'delayed' due to the fact that AMD is production constrained and the 32nm fab is full steam for the past few months for Llano release. AMD does not have a fab of their own and GF is actually pretty small compared to TSMC, therefore it is more likely that it is production constrained. The 60-90 days could be an indication that they were just beginning to mass produce and package BD for August-October launch.

That is why I mentioned before that even if BD is what it thought to be and it totally destroyed SB in every single test it won't be able to be a huge hit due to the fact that GF is small and cannot meet the demands like Intel could with their fabs. That could also be the reason that Intel might not budge SB pricing even if BD were to come out because Intel knows that AMD is production constrained and cannot exceed 20% of the market's demand.

Not very easy to implement PCI-E 3.0 at this stage. Even Intel is having trouble with PCI-E 3.0 on their LGA2011 and there are rumors that the early version of LGA2011 boards will come with PCI-E 2.0 instead because implementing PCI-E 3.0 will delay them further till next year.

Most probably. AMD said the delay is a strategic move.  I am more worried about their process rather than their architecture.
Well trinity is still on scheduled even bulldozer got delayed.
IINM SB-E comes with pci-e 3.0 but doesnt come with usb 3.0

Even if it is said that Trinity is on schedule, it doesn't mean that it will come out this year. It will still come out next year at its intended release date. Despite BD being 'delayed' it should still be released this year nonetheless. I mention 'delayed' instead of delayed to point out that BD has no official news from AMD that it is delayed and I was corrected before on the notion that BD is delayed.

Which motherboard does not come with USB 3.0 these days? laugh.gif Paying top dollar for an uber expensive motherboard just to not have USB 3.0 is just daylight robbery. You can read more here.

It was pointed out that there could be a possibility that BD was never delayed and it is 'delayed' due to the fact that AMD is production constrained and the 32nm fab is full steam for the past few months for Llano release. AMD does not have a fab of their own and GF is actually pretty small compared to TSMC, therefore it is more likely that it is production constrained. The 60-90 days could be an indication that they were just beginning to mass produce and package BD for August-October launch.

That is why I mentioned before that even if BD is what it thought to be and it totally destroyed SB in every single test it won't be able to be a huge hit due to the fact that GF is small and cannot meet the demands like Intel could with their fabs. That could also be the reason that Intel might not budge SB pricing even if BD were to come out because Intel knows that AMD is production constrained and cannot exceed 20% of the market's demand.

^ all PCI-E 2.0??
hope they come up with PCI-E 3.0 for more future proof.

heard about this capacity thing before. from AMD announcement before in june people expect the worse we well see bulldozer in september (i believe this is the time people start speculating about that capacity thing). then some rumor comes out that the processor will out by october which lead some folks believe that AMD really have a problem with bulldozer and the delay was not caused by insufficient capacity at GF alone.

AMD A8-3870
► 3.1GHz (?)
► 4MB L2 / 100W TDP
► AMD HD6550D
► Unlocked multipler for easy overclocking

^ all PCI-E 2.0??
hope they come up with PCI-E 3.0 for more future proof.

am3+ socket will last for how long? until next gen of bulldozer comes out?
planning to get am3+ mobo

am3+ socket will last for how long? until next gen of bulldozer comes out?
planning to get am3+ mobo

Lol.. the proc can last you long especially the 8-core proc.. you wont use so much core yt..

Not very easy to implement PCI-E 3.0 at this stage. Even Intel is having trouble with PCI-E 3.0 on their LGA2011 and there are rumors that the early version of LGA2011 boards will come with PCI-E 2.0 instead because implementing PCI-E 3.0 will delay them further till next year.

just wanna upgrade my mobo
mayb after few year will chg to 8 cores proc, n mayb tat time am3+ ald phase out

maybe can stand for 2yrs,seems its 8core. nowadays also we can't even use all 6core for gaming,juz quad core only. more than quadcore used for graphics designing like rendering.

am i rite? if wrong pls correct me,i'm a noob. tq

maybe can stand for 2yrs,seems its 8core. nowadays also we can't even use all 6core for gaming,juz quad core only. more than quadcore used for graphics designing like rendering.

am i rite? if wrong pls correct me,i'm a noob. tq

8 core is good for folding, especially with -bigadv.

more than quad core, can use for folding@home as well.