QUOTE(fesick @ Apr 3 2008, 11:01 PM)
why need to transfer the heat through 3 pipes?
why not just transfer the heat directly to each heatpipe..
if we compare both cond A & B .. logically in cond B the tim usage are less than tim in cond A..but its all depends
i've edited my previous post with added link
okay here is my point of view,
1. applying tim on every single heatpipe as u mention is not 100% sure the paste wont spread and touch the next heatpipe paste.... unless u are very accurate....(take off ur HSF and see after few days and see the spread of ur paste)
2. if u can achieve the no.1 then u must be sure the paste is spread along 3 heatpipe and have divider in between them, about 1.5mm only.. which is difficult to do it after u pressured it onto CPU.......(take off ur HSF and see after few days and see the spread of ur paste)
3. my own logical thiking on "why need to transfer the heat through 3 pipes?" its to best optimise all 3 heatpipe usage.... as we know processor die inside is not as big as the whole IHS, and the heat from the die is not even across the whole IHS, so if u do that divider thggie for 3 heatpipe.... im very sure the mid heatpipe will be hotter compared to the side 1 due to the arrangement of cores inside the processor. Then the side will be cooler.... this is not very efficient...... for example 3 heatpipe.... 50'c | 65'c | 50'c.... not very efficient..
So if all 3 heatpipe are link then at least the hotter section can spread the heat to the side heatpipe which is cooler to cool it down.... for example 54'c | 58'c | 54'c... more efficient
all above stated is just my personal logic thinking and no fact proven..... i might be wrong
This post has been edited by vincentlaw: Apr 4 2008, 12:24 AM