interesting looking hsf... nice idea.... performance is not bad...wat do u guys think?

http://www.techpowerup.com/reviews/Xigmatek/082Cooler/1









This post has been edited by lolhalol: May 29 2007, 02:18 PM

Hmm, another heatsink that uses the concept of direct contact of heatpipe to the processor.

doubt it will be that good because the surface will not be that flat no matter how well it is lapped.

Maybe they should at least put a thin layer of copper at the bottom?

wow.......

nice heatsink ....

is it avaible yet in malaysia????

i would say put aluminium since it attracts heat faster compared to copper.

Are you kidding me? Copper's heat conductivity is at least 30% more than aluminium.

But really, if anyone wants to be extreme, use a silver plate. Silver is the best heat and electrical conductor for any single metal at room temperature. At least 10% better than copper.

Silver is not the best heat conductor. See here : http://hyperphysics.phy-astr.gsu.edu/hbase/tables/thrcn.html

This post has been edited by kmarc: May 29 2007, 10:56 PM

Well I did say metal; diamond isn't a metal. But yes, diamond is the best solid heat conductor known-a damned expensive one at that. There might be better ones, but only under very specific conditions. In any case, a typical heatpipe actually has better heat conductivity than any pure metal, but the heatpipe orientation and temperature range matters a lot in that aspect.

---

Added on May 29, 2007, 11:11 pmAnd yes, thanks for the table. So to set the figure exactly, copper conducts heat 87% better than aluminium, and silver conducts heat 5% better than copper and 98% better than aluminium

This post has been edited by lohwenli: May 29 2007, 11:11 PM

another direct contact cooler

http://www.techpowerup.com/reviews/3RSystem/ICEAGE

n it does work wonderfully as tested by this chap at XS forum

http://www.xtremesystems.org/forums/showthread.php?t=143099

I've known from the start that this kind of heatsink that uses direct contact between heatpipe and processor's have a good performance.

What we need now is more end user reviews.

there is a diff between conductivity and atrractivity.
think bout it. if copper is better, then why are the fins aluminium? this is because of its ability to extract heat ahd disperse it quickly

just to add onto the topic.


This post has been edited by DaRkSyThE: May 30 2007, 10:41 AM

copper is good in absorbing heat but its very hard to disperse heat... at least harder than alu, thats the reason why they use alu fins... i think that the reason

well here is my logic...
the copper base and heatpipe absorb the heat from the processor and then transfer them to the alu fin and the fan will cool down the fins....

correct me if i am wrong

This post has been edited by sup3rfly: May 30 2007, 10:55 AM

Ok, back to physics 101.

Copper is superior to aluminium in terms of heat conduction (Thermal conduction)
Aluminium is superior to copper in terms of heat absorption/dispersion (specific heat)

Refer to the following hyperlinks:
http://www.ee.byu.edu/cleanroom/thermal_properties.phtml
http://www.answers.com/topic/specific-heat-capacity
Aluminium & copper heatsink (This is interesting!!!)

Summary : Copper for the base to collect the heat quickly. Aluminium for the fins to get rid of it.

P.S. Yahoo! My noctua is in this setup!!!!

This post has been edited by kmarc: May 30 2007, 11:33 AM

Not really. There is no such thing as heat attractivity. And the specific heat capacity has little effect on losing heat, only effects the time it takes for thermal conditions to equalise (aka hysteresis).

The proper answer is-density. Aluminium is much, much lighter than copper for the same volume, and you can easily put a hell lot of thin fins and increase the surface area without a significant increase in weight. And with that much surface area, the lower heat conductivity of aluminium can be minimised. Using a similar design in copper will significantly increase the weight of the heatsink, those who own all copper heatsinks should know this quite well. Dropping on your foot one of those all-copper heatsinks which are huge enough to perform equally to their aluminium fin counterparts will really hurt, and I'm not talking about the damage to the heatsink

Heatpipes on the other hand, are made of copper because it is absolutely critical for the heat be conducted to the fins, or else why even put fins at all? The non-heatpiped heatsinks suffer this problem-heat is not well distributed to most of the fins, and even on the same fin its hard to conduct heat from one end to another due to the low thickness of the fins.

wow, does this mean that the base in contact with gc is copper and the fins aluminium will give the best2 heat dissipitation? Read all yr previous remarks but nobody came outright to say which configuration is best....

That's true. We're already into discussion about thermodynamics!!!

The discussions were theorectical and what we need are hard facts. If two heatsink of identical design, heatpipes + aluminium fins and heatpipes + copper fins (disregarding weight), who would win? Any data?

well...the full copper will win but it requires higher cfm fan to cool it down...thats why u see the xp90C is so good last time

full copper definately better than copper + alu but in term of efficiency as fan cfm vs performance, copper + alu will win

All copper will win even for the same airflow. But it will be only by a slight margin, which will not be worthwhile considering the weight. You can see this clearly in XP90 vs XP-90c. The winner isn't terribly clear, because the high conductivity of the heatpipes already distibutes heat very well to the fins.

I'm not too sure about this. I know heatsink manufacturers have a tendency to use a design that takes up less space for copper heatsinks due to weight, which usually results in fins close together (which gives damn good cooling with high cfm, but hopelessly bad cooling at low cfm). Has anyone tried out the XP-90 and XP-90c with a variety of different fans?

ok lets get back to the discussion of this heatsink. not much point going around the same thing over and ovef again