QUOTE(:3mushy:3 @ Apr 28 2009, 02:24 PM)
Thermal pad works on the same principle as thermal paste, and no it does not bond the CPU and the HSF as strong as super glue. Under the pressure of push pins, the thermal pad will be squeezed just like the thermal paste, plus you don't need to worry about the leakage or excessive application of thermal paste with the pad.
Me? I used generic brand of thermal paste (RM4/tube, can use twice), it works with no hassle. Think again whether it is worthy to spend RM20-RM30 just to drop a few degrees even in a safe temperature range?
i was referring to thermal paste when i mentioned the super glue bond.. cos got some cases where after a few years of using the same thermal paste, the proc got stuck to the hsf and it's really hard to separate them without damaging the proc... (rarely seen with silicon based thermal paste though)

thermal pad shouldnt have this prob since they wont become rock solid after prolonged usage right? the leakage issue is a good point u mentioned. for those who have no idea how to apply thermal paste properly, a thermal pad should provide an easier solution. dont have to worry about the amount, or how to spread it, etc. so there are pros and cons for each type.. stock thermal paste or pads work well enough for those who doesnt oc their proc... better save up the rm30 for a better hsf huh? i agree with that

saving up for a red scorpion myself!
QUOTE(ktek @ Apr 28 2009, 02:30 PM)
not always, when you got BIG GAP (surface blocked by something) then it's another way around

and then you cannot use thermal paste to heatsink that don't have clip or screw, it won't stick for long time.
thermal pad wins in that case.. hehe.