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 China 14nm > 4nm

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Pain4UrsinZ
post Nov 29 2025, 08:43 PM

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So it means the west keep introducing 8nm 4nm 2nm , smaller and smaller but all the while didn't really maximise their efficiency and capacity.
k!nex
post Nov 29 2025, 08:52 PM

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QUOTE(Pain4UrsinZ @ Nov 29 2025, 08:43 PM)
So it means the west keep introducing 8nm 4nm 2nm , smaller and smaller but all the while didn't really maximise their efficiency and capacity.
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They did .
The term is call performance per watt with each lithography upgrade.
You look at how many FP32 TFLOPs can Nvidia GPU can put out for roughly the same power budget.
4090 > 5090 did get a significant performance upgrade but at a huge cost of power consumption. Because it is all based on TSMC 5nm tech.

3080 to 4080 gets significant upgrade without a significant increase in power consumption is because of going from Samsung 8nm to TSMC 5nm process node.
TSnovblaze
post Nov 29 2025, 09:46 PM

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QUOTE(touristking @ Nov 29 2025, 08:38 PM)
Tesla was deliberately allowed to come into China to force China EV makers to improve.

Likewise, USA is forcing China to improve their chips.

Same thing.
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But there's no Tesla for chips goes to china
cms
post Nov 29 2025, 10:03 PM

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BYDs od chips coming to shake the old dogs ?
rtk73
post Nov 30 2025, 07:05 AM

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QUOTE(ipohps3 @ Nov 29 2025, 04:53 PM)
if you know semiconductor science, it is possible. it is called near memory compute. reduce latency and power through 3D stacking advanced packaging.
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Those advanced packaging machines are still relatively restricted by us to be sold to Chinese companies
Emily Ratajkowski
post Nov 30 2025, 08:02 AM

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lol.

my less dense object can sink faster than the densest stone.

dengar bole. percaya jangon
ornehx
post Nov 30 2025, 08:17 AM

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QUOTE(Emily Ratajkowski @ Nov 30 2025, 08:02 AM)
lol.

my less dense object can sink faster than the densest stone.

dengar bole. percaya jangon
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Wat if the more dense object shaped like a parachute. And the less dense one shaped like an arrow. It's will be a close one
6942nole
post Nov 30 2025, 08:33 AM

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you can laugh right now.
when China wanna do something, they will succeed. because they are not worried about the voters to vote them out of power, thus can plan long term.

it is just a matter of time.

HSR and space station are the prime examples.
yed
post Nov 30 2025, 08:39 AM

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Puak selalu claim
Marcion
post Nov 30 2025, 08:50 AM

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QUOTE(Penamer @ Nov 29 2025, 06:06 PM)
you all must remember, all these 14nm technology was developed pre AI era. When you use AI to optimize all these old technology, only AI knows how much efficiency gains you can get.

just like how come where winds meet can run so smoothly on my 5 year old lenovo laptop with gtx1650 because netease used AI to optimized the game engine.


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You also play.
RicoT
post Nov 30 2025, 09:01 AM

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Ultimately, this comes down to differences between Chinese and Western testing standards. BYD frequently highlights NEDC or CLTC range figures, which certain channels then misuse for misleading comparisons. EPA ratings, however, give a far more realistic measure of actual driving range.
thkent91
post Nov 30 2025, 09:42 AM

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Using their own ccp software benchmark sure can win
mrhulk
post Nov 30 2025, 09:55 AM

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it is alot harder to go from 4nm to 3nm, compare from 14nm to 4nm....china will catch up in next few eayrs...
buysellaccount
post Nov 30 2025, 10:04 AM

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Power consumption must be dhit if they can get 14nm to perform like 4nm

But...

It is only a matter of time, in a decade at most

China will grow larger
culvers
post Nov 30 2025, 12:07 PM

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Yes everything they make is fake so don’t need to be afraid of them at all because they gonna collapse real soon. See how the US is not even trying to do anything to contain them.
h@ksam
post Nov 30 2025, 12:52 PM

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don't challenge Moore's

don't challenge transistors in nm.

QUOTE
A "1.4 nm chip" refers to a next-generation semiconductor chip using a 1.4-nanometer manufacturing process node, which is a significant advancement over current technology. Companies like TSMC, Samsung, and Japan's Rapidus are competing to develop and produce these chips, which are expected to power future high-tech devices like AI-powered smartphones, autonomous vehicles, and data centers. Mass production for these chips is anticipated to begin around 2028.      

Manufacturing process: The "nm" in 1.4 nm stands for nanometers and refers to the size of the transistors on the chip, with smaller numbers indicating more advanced, more energy-efficient, and more powerful chips.    

Expected performance: The 1.4 nm process is projected to offer significant efficiency gains, such as up to 30% lower power consumption at similar speeds to previous nodes, or higher performance at the same power.    

Key players:        
TSMC: Is building a new, highly advanced fabrication plant in Taiwan, with mass production of its 1.4 nm "A14" process targeted for the second half of 2028.        
Samsung: Plans to begin mass production of 1.4 nm chips in 2027.        
Rapidus: A Japanese chipmaker, is planning a second factory to produce 1.4 nm chips, with production potentially starting in 2029.
    
Target applications: These chips will be used in high-performance applications like high-performance computing (HPC), artificial intelligence (AI) acceleration, and advanced consumer electronics.


This post has been edited by h@ksam: Nov 30 2025, 12:56 PM
Ayer
post Nov 30 2025, 12:55 PM

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China will grow larger
SUSipohps3
post Nov 30 2025, 01:01 PM

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QUOTE(rtk73 @ Nov 30 2025, 07:05 AM)
Those advanced packaging machines are still relatively restricted by us to be sold to Chinese companies
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china building themselves domestically. no need the so advanced euv machines.
issac99289928
post Nov 30 2025, 01:12 PM

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china can mass produce euv machine next year. finetuning the process will take a few more months. china can mass produce 3nm chips in year 2027.
rtk73
post Nov 30 2025, 01:32 PM

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QUOTE(ipohps3 @ Nov 30 2025, 01:01 PM)
china building themselves domestically. no need the so advanced euv machines.
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Not even euv, I'm talking about etching, clean and deposition tools

Including 3D packaging tools Ofcos

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