IMO the most notable way to tell whether a 360 is a Jasper Rev. or not is to look at the power connector itself.

I posted this over at FM and I'm posting it here as well.

http://i3.photobucket.com/albums/y64/faran...Model_Guide.jpg

http://www.flickr.com/photos/7591768@N05/3...in/photostream/

There you go.

Looking at the MFG date isn't the most ideal option to spot a Jasper.

IMO the most ideal way (which I have posted in another thread) is by looking at the connector on the console side. However this does prove to be useless if you can't open the box without buying first. So the next method is to look for a 12.1A rating on the sticker at the back of the console through the box.

http://forum.lowyat.net/index.php?showtopi...post&p=21927763

Actually if you can't open the box, you still can determine whether the unit is a Jasper or not. There's a small cutout hole which you can spot the barcode for the console. Just move the console to the right and look at the power ratings. 12.1Amps and you're good to go.

But for those that can open the box, I'm talking about people who are buying the pre-modded boxes. Yeah, just look at the connector. It's the most noticeable way to tell apart.

Anyway, Anandtech has a new article about Jasper with power consumption measurement. Not really a drastic reduction as compared with the transition of Zephyr to Falcon but still a 15 - 20W reduction during gaming is still good.

http://www.anandtech.com/gadgets/showdoc.aspx?i=3472&p=5


However, one thing that got me wondering is on Page 1 of the article. The author writes about the plague of failing Nvidia GPUs (The notebook 8 series) and how it could be related to the Xenos as well. So, if this is correct to some extent, then maybe this is why people who did the GPU replacement still has the Red Rings Syndrome. It's not the connection to the motherboard that is the problem but in fact the problem lies with the GPU die to GPU Substrate connection.

http://images.anandtech.com/reviews/gadget...sper/layers.jpg

Let's hope that MS swapped for the newer solders in Jasper yeah?

As the article has written, the main problem might not be heat related. But it's all due to the solder that is used to connect the GPU die to the GPU substrate and not the solder than connects the substrate to the motherboard.

Having better cooling might not solve the issue entirely although it might prolong the life of the console by a margin. They need to replace the solder with eutectic ones.

So in conclusion, if this piece of news is true, which it might be anyway considering the previous revisions still fail on you no matter what you do. Jasper will still suffer the Red Rings if they did not change the type of solder they are using previously.

Anyway it's still a rumour after all. Let's just sit back and see how it goes.

Read the previous pages. It IS out but you need to hunt for it.