Jasper - significantly low red ring death rate ?

I believe so.

Dun understand why Microsoft took.... more than 3 years to get it.

Actually if you can't open the box, you still can determine whether the unit is a Jasper or not. There's a small cutout hole which you can spot the barcode for the console. Just move the console to the right and look at the power ratings. 12.1Amps and you're good to go.

But for those that can open the box, I'm talking about people who are buying the pre-modded boxes. Yeah, just look at the connector. It's the most noticeable way to tell apart.

Anyway, Anandtech has a new article about Jasper with power consumption measurement. Not really a drastic reduction as compared with the transition of Zephyr to Falcon but still a 15 - 20W reduction during gaming is still good.

http://www.anandtech.com/gadgets/showdoc.aspx?i=3472&p=5
However, one thing that got me wondering is on Page 1 of the article. The author writes about the plague of failing Nvidia GPUs (The notebook 8 series) and how it could be related to the Xenos as well. So, if this is correct to some extent, then maybe this is why people who did the GPU replacement still has the Red Rings Syndrome. It's not the connection to the motherboard that is the problem but in fact the problem lies with the GPU die to GPU Substrate connection.

http://images.anandtech.com/reviews/gadget...sper/layers.jpg

Let's hope that MS swapped for the newer solders in Jasper yeah?

to me it seems like it's not the GPU heated up that caused the 3RRoD.

The 3RRoD is just identifed as General hardware error which can be related to everything in the system....

What I'm going to discuss about is the broken GPU soldering...

As we know PC's GPU will also become very hot when fully loaded and sometimes up to 95C and they never seems cooked....or AFAIK they're not.....

For me it looks like somehow the material they used, be it circuit board, GPU casing or the soldering itself is not heat tolerant.... and I'm don't understrand why the material is not changed till now..... PS3 or Wii will also overheat but they never suffer from broken solder joint.......

So, basically reducing the thermal junction problem between GPU/CPU core casing and mainboard seems more promising to eliminate the broken soldering problem....

How? haha, conclusion back to square....use a better heat solution OR A/C blast which might risk condensation to suck as much heat as possible from the cores.....you cannot dissipate heat on mainboard as quick as the CPU/GPU core even with a very good heatsink

This is why M$ will never solve the problem unless they change the material used OR design a core with no excessive heat dissipation....something like Transmeta Crusoe processor or Intel Atom processor

Guess what? My friend still has a surviving Xenon, bought from you (along with me and another friend, both of us 3ROD already) way back in Dec 2006. Not even signs of 3ROD. But he rarely plays the console, even when he does it'd only be about 1 hour max.
Oh and he's still using the default dashboard. 

Yo... is that the Arcade one? Without the hard disk?

wat is the use of hard drive?

lol i used a 160Gb and made a 120Gb xbox hard disk

When this jasper is coming SERIOUSLY to the world, i don't see any announcement from Microsoft

I see no shoppers talking about this thing .... 

i dun get it...y u leave it on when urr not using it?