Below is how does the thermal paste seperate when I installed the S1283 vertically. I wonder that how you guy put the thermal paste when using the S1283 cooler. Normally, I put a small drop on center of the proc as what I did for few previous cooler. Somehow, I remount the cooler recently but the temperature is higher a lot than before, 3.3GHz full load @ 60~61'c with surrounding temperature 32'c in the morning. I recheck the mounting and there is nothing wrong. Maybe someone can enlighten me?



This post has been edited by gsan: Mar 29 2008, 10:00 AM

IMO, You can't use the rice grain drop method on HDT technology.
Try spreading a thin layer of TIM on the IHS.
See either it perform better or worse.

But still, i don't think the rice grain drop method is useful on HDT technology.

owh, no wonder like that.........use a paper to spread the thermal paste evenly........btw, i already banked in the balance to you

I got the higher temperature with that method as well.
This is because of the drop wont be wide enough to let the heatpipe get in touch with processor IHS
Thermalpaste should be applied to all heatpipes in order to dissipate the heat faster.

The reason why the rice grain method won't work on HDT based heatsink is because HDT tends to have some "longkang" on each side of the heatpipes, thus, it reduces the thermal transfer power.

If you use rice grain method, the TIM layer will be so thin, it won't go into those "longkang" which will result to a weaker thermal transfer.
On HDT, you need to spread the TIM all over the processor's IHS, with a lil bit more TIM on the IHS, some of the TIM will be pushed into those "longkang's".

Despite the high performance of HDT technology based heatsink, i found two weakness in HDT:
1. You can't use HDT based heatsink on naked core CPU & GPU.
2. You have to use more TIM compared to non HDT heatsink.

PS:
Sorry, i don't remember what's "longkang" in english. Sorry!

This post has been edited by sHawTY: Apr 10 2008, 05:33 PM

lol... drain if i'm not mistaken bro...

so, the thermal paste should apply evenly on the IHS only and both the IHS and the base of the s1283?

No, but i'm not really sure the best apply method though.
I apply a thin line along the IHS (AS5 method for quadcore) then add a bit at each side of the line(this is to ensure there is thermalpaste in between the IHS and heatpipes).

not sure about the ultimate method, but usually i'll spread it all even on the IHS, but no too thick....

this method so far considered successful as i've even removed a heatsink with AM2 proc stuck on the base(came off together when i remove the heatsink, heck, the clip is still locked)

this is quite often to happen when using AS5, for me though

i apply tim at each heatpipe

agreed, most of the TIMs tend to be 'pushed' to the grooves in between the HDT pipe & the alu base. Droop method isnt effective on HDT. need to spread a thin line adjacent to the pipes

What a good explanation I must say

I totally agree with brother sHawTY in the ways to apply the TIM on HDT.

based on earlier discussions in ckhoong's thread, a rep from xigmatek had already explained that the best method to apply TIM on s1283 is using 'rice grain' method... even some users like kmarc 'invented' his own method in applying TIM, its not that effective than applying it normally...
therefore, i apply TIM as usual, using rice grain method... so far, no problems... it has been 8months... huhu

it should be fine if your rice grain size is big enough to cover all three heatpipes.
did you ever take the cooler out and have a look on the heatsink base?
were the TIM got contact with all the heatpipes?

I've tried the rice grain method and it doesn't work well. Like what our forumers has said, a lot of TIM will just go into the grooves. You'll find that it doesn't spread out nicely, and the side heatpipes don't get much TIM at all.

Furthermore, if you attempt to put more TIM in the middle, you'll end up with a thick paste in the middle, causing less contact....

For me, I just apply a thin line of TIM on all 3 heatpipes. Maybe a blob on the aluminium plat too. When I remove the HSF after a while, I noticed that it does cover the proc and based of the HSF evenly.....

This post has been edited by kmarc: Apr 7 2008, 07:41 AM

guys. just wanna ask. if not all of the push pins are not in place, can it affect the temp? b'coz only 3 out of 4 pins is properly secure... will my proc temp increase higher than a stock intel cooler?

YES.
Indeed it is hard to secure all of the 4 pin.

What should you do is take out the motherboard and fix the heatsink to the board before you put it back into the casing.

PS:
This is why most hardcore users prefer bolt through compared to push pin method.

oh then i am in trouble. i just broke the pin. haha. now i have to purchase a bolt thru kit...

got pic? it worth billion words