I think something isn't right if people need to spend even more just to get a CPU to properly come into contact with the heatsink

AMD 1st implementation of LGA is real cacat. Instead of enlarging the socket size and putting the tiny micro capacitors under the center of the CPU substrate (like Intel LGA), they cut out the IHS into spider form and jam pack those capacitors around the gaps in the IHS. Not only does it make the CPU more delicate to damage when handling vs Intel LGA, it also makes a POS when trying to clean thermal paste specially if it leaks onto the capacitors, good luck trying to clean without knocking some off.

Which is why Noctua/CM has plastic templates for paste application on the spider IHS but doesnt stop it smudging down the sides. Which is why there are replacement ILM frames for AM5 socket too, to prevent this. Dua dua CPU makers pun bodoh.

From an OCer POV, AM5 LGA is much worse when comes to delidding as you need to be super extra careful around these capacitors, even derbauer delidder tool has higher risk of failure compared to using on Intel LGA.

I not really sure why AMD decided AM5 like that, maybe its not upset their current AM4 user base that could migrate their coolers without extra hardware (unlike Intel LGA needing LGA1700 adaptors kits) or they did not want the same jokes as Intel bending issue but whatever the real reason, AMD LGA for AM5, AM6, etc is tech dozzy unless they could redesign the spider IHS for AM7.