Think about it. The only difference between E6750 and E6700 is the FSB speed (1333Mhz vs 1066Mhz) and stepping (G0 vs B2). Other than that, both are exactly the same especially the TDP and 65nm manufacturing process.

As such, how can the E6750 be so much cooler on stock heatsink as compared to the E6700? 

However, if you look at their specs, apparent the thermal specification for both are also different. E6750 is at 72'c while the E6700 is at 60.1'c (See table below)

This is Intel's definition of thermal specification "Thermal Specification:  The thermal specification shown is the maximum case temperature at the maximum Thermal Design Power (TDP) value for that processor. It is measured at the geometric center on the topside of the processor integrated heat spreader. For processors without integrated heat spreaders such as mobile processors, the thermal specification is referred to as the junction temperature (Tj). The maximum junction temperature is defined by an activation of the processor Intel(R) Thermal Monitor. The Intel Thermal Monitor's automatic mode is used to indicate that the maximum TJ has been reached"

Anybody care to explain what thermal specification means in the OC world?

Added : Comparison table - look especially at the thermal specification (maximum case temperature) of E6750 vs 6700 

So how if we oc the cpu and not reach the max case temperature? It should be safe right?(Not sure bout the core temp though)

What type of pencil mod did you do? hmm.gif