the best material for
thermal conduction is diamond

~1800 W/mK

if anyone is interested



diamond are not forever

anybody in the processor industry ?

i always ask myself what is the material for the processor die, i mean the surface of the proc for then heatsink to lie on.

IHS, dunno, but some said copper
DIE, the die is using silicon + gemanium.
this two semiconductor making the wafer for all die.

ram is different bcause the packaging.

about thermo, heat dispassion rate is an important factor.
copper may absorb 400W/mk of energy, but how fast does it release?
yet we may see the comparison of xp-90 and xp90c.
i hope that may get a chance to test it, using different airflow and air pressure.

i believe that is the heatsink is good, it does not need to be full copper.
combination of copper + alu is great enough.

about nickel
90.9 W/(m·K) thermal conductivity
and
13.4 µm/(m·K) thermal expansion

This post has been edited by Westley: Jun 11 2006, 12:38 PM

please bare in mind that there is no dissipation characteristic of a material....

but there is thermal conductivity and specific heat..


try to ponder on it....and youll get the idea

another good material for thermal conductance is BN - boron nitride
hard as hell but good therm properties.

Aleck as always, the WC guru.

There is no such thing as difference in heat absorbsion and heat dissipation. Thermal conductivity is thermal conductivity as it is, regardless in absorbing heat or releasing heat.

The best metallic electricity and thermal conductor is silver. Not gold. In fact, copper has better electricity and thermal conductivity than gold. And yeah, the best thermal conductor is diamond. It is possible to make cultured diamonds, real ones, just not formed in a natural process. And its composition is even more pure than a natural diamond. So, yeah, you can make pretty large ones and make them into waterblocks or heatsinks

but on specific heat capacity.
is alu>diamond>copper

This post has been edited by Westley: Jun 12 2006, 12:22 AM

nicely explained...

Given 2 heat sinks with exactly the same design....one copper and the other allu.
The copper one will always be supperior except that it will be 3 times heavier


But ussualy we cant get exactly the same design when using copper or allu due the fact that both goes through different manufacturing processes.

U can easily find an allu hs made from a single chunk(extrution) but it would be rare to find a cooper hs made out of a single chunk of copper. They need to solder the fins to a base to get the surface area hence creating thermal junctions that hampers the conduction of heat.

Same goes to allu and copper radiators. Allu radiators are far more superior than their copper counter parts because the manufacturing process and technology of brazing allu radiators are far beter than brazing copper rads. Copper rads usses tin as its brazing filler and this creates alot of thermal junctions. Where else allu does not need foreign material as a filler but melts and clings together by itself at <400deg with the help of some brazing flux

aleck, that means water cooling, alu made radiator is much advance because of tech applied?

it's not tech, but the fins has got 2 layers of material.
the outer material is has a lower melting temperature

they are sent into an oven with temperature more than 500°C (something like a conveyer belt which passes unsoldered radiators thru a heater) where the outer layer will combine with the fins, i mean the fins in " NNNNNNN " with the bone structure with which either gas or water passes thru.

this technology is very old de. it's a cheap and a practical way.

but i have not seen manufacturers did heatcores as in heatsink style, due to the heavy cost ??
which is to cover every copper material with nickel and then the soldering comes in.

now i only know that the solder joints are called thermal junctions
i always see them in PDF files but i dont care to find out about them

the aleck is the guru of thermal stuff

This post has been edited by AllnGap: Jun 13 2006, 08:53 AM