everybody is talking how the legendary 3ROD/3ROL related to 65nm or 45nm technology. can anyone relate how the 65nm or 45nm technology related to 3ROL/3ROD?

as far as I know the 65nm or 45nm technology is the process of shrinking the transistor size to have a better dice per wafer where more logic transistor can be embedded to the wafer.

of course in between the process if the leakage issue is not tackle then thermal will be an issue.

so back to the legendary 3ROD/3ROL issue, can someone explain how the x-clamp solution related to the 65nm or 45nm process technology?