TSMC says its newest process tech doesn't need ASML's High-NA EUV chipmaking tools that have been championed by Intel, but the foundry is exploring the tech for future use.

According to Reuters, Zhang told attendees of the event that the A16 process technology will not need the next-generation EUV lithography tools. This implies means that TSMC has found ways to cost-efficiently use EUV double patterning and pattern shaping to increase the achievable critical dimension of a modern Low-NA litho system beyond 13nm.

In contrast, Intel plans to insert High-NA EUV tools with its 14A manufacturing technology after it learns how to efficiently use them with its 18A production node.

TSMC is not standing still, though. The company is exploring High-NA EUV lithography for its future process technologies. The A14 node will follow A16, and as TSMC noted in its 2023 Annual Report, A14 development is well underway.

"TSMC started development and made good progress on 14 Angstrom (A14) technology, which aims to further improve speed, power, density and cost," the company's Annual Report reads. "Looking ahead to A14 and beyond, TSMC R&D will continue to explore next generation EUV (extreme ultraviolet) lithography scanners, conduct research on mask pellicles and blanks to support leading-edge technology and extend Moore's Law."

Using High-NA EUV lithography systems greatly increases fab costs as each tool costs $385 million or more depending on the configuration.

Chipmakers tend to re-use as many tools as possible, so TSMC may not be inclined to use High-NA EUV before it runs out of ways to introduce improvements to its production capabilities using Low-NA EUV tools. For example, last year, the company improved the critical dimension and pattern fidelity as well as lowered defect density by modifying photoresist and blank materials as well as optimizing mask process recipes. It also uses deep learning for inspection and discovering defects.

"In 2023, to achieve the wafer yield and productivity for lithography requirements at 2nm node, the R&D team improved the critical dimension, pattern fidelity, overlay stability, exposure durability, and defect mitigation of curvilinear patterns by EUV photoresist and blank material modification, multi-beam writer resolution enhancement, mask process recipe optimization, and advanced deep learning inspection," TSMC said in the report. "Future improvements will focus on developing new blank materials and new mask process technology at the A14 node and beyond."

TSMC's announcement of its A16 process technology (1.6nm-class) with Super Power Rail backside power delivery came as a surprise at the company's North America Technology Symposium 2024. Kevin Zhang, Vice President of Business Development at TSMC, said that the world's largest contract chipmaker had to speed up development of the production node due to rising demand from the AI sector, reports Reuters.

so, mana 3nm senakdragon?

so, mana 3nm senakdragon?

SD 8Gen4

Kambing soon. TSMC says no need to buy overpriced ASML's overpriced High-NA EUV machines for now, wait a while we develop new technologies to delay using it for time being to save costs and if China has something more interesting in development to bypass ASML's sanctions?

interesting in development? curi la, apa lagi.

interesting in development? curi la, apa lagi.

interesting in development? curi la, apa lagi.

TSMC milk China.

Suddenly Taiwan and Japan is now grouped along with China.

meaning the tech is too new and still not mature? wait for 2nd gen machine later let intel be the tester now?

will the cost rise if buy later due to inflation?

Means new phones will get cheaper?

If the choose to use TSMC more economical solutions.

Intel will most likely transfer the higher cost of investment in the High-NA EUV machines to its customers.

Intel chip used in which phone?

Intel chip used in which phone?

We are talking about wafer fabrication outsourcing here.

Kenot understand liao

So no more new phones using intel?

Tsmc yang discover breakthrough….
Wumao peasants here yg excited pulak want to claim credit for shina….

Lmao!

Stupid xixipee peasants really think they own tsmc?

Those people at TSMC is Chinese or not?

Kevin Zhang, Vice President of Business Development at TSMC

Zhang family name is not Chinese origin?

Zhang only exist in China and Taiwan

Malaysia is Chong

Zhang (张), meaning ‘to stretch a bow’, is the 18th most common surname in China. Many communities worldwide in places like Malaysia, Peru and Macau also share the same surname.

The roots of the Zhang family stretch far and wide. Most Zhang descendants can trace their ancestry back to the bloodlines of Huang Di, or the Yellow Emperor.

Good news for fabless chipmake like qualcomm

But i doubt the cost savin will passdown to consumer

Anyway Looking forward  for s8g4 on s24 ultraaaaaa

not s25 🤔

Suddenly Taiwan and Japan is now grouped along with China.

Those people at TSMC is Chinese or not?

Kevin Zhang, Vice President of Business Development at TSMC

Zhang family name is not Chinese origin?

Chinese in tsmc and chinese in mainland shina very2 different

Chinese in tsmc, their brain more superior, higher iq, not brainwashed by xixipee propaganda. Thats why tsmc very succesful

Chinese in mainland shina are more stupid, brainwashed, with peasant mindset. Everday think of way to scam, steal and copy…. Only know how to copy ppl then shamelessly claim credit for everything. Many times try to undermine tsmc, shameless steal all their engineer, do spying and industrial espionage, but so far, still fail to emulate tsmc …..
LMAO!

That is what angmoh try to play conquer and divide games with the Chinese.

Whether you're Taiwanese or Chinese across the world, your ancestry is actually traced back from China.

LMAO!
shina peasants just cant stop shamelessly claiming everything taiwanese.

meaning the tech is too new and still not mature? wait for 2nd gen machine later let intel be the tester now?