QUOTE(rainingzero @ Nov 30 2007, 08:08 AM)
u are the god of underclocking which is in the different class of ur own....
very envy ur skill la....

Visit silentpcreview often and you'll kena poison eventually. The silence of passive cooling..
Gotta clean my worktable tonight or I'll never get to play with the F3, nowhere to work on that system with the desk cluttered with 4 dinosaur PCs..
Btw, underclocking is really easy with any K8 processor..much easier than overclocking..its with intel systems that its difficult, often need harware mods.
QUOTE(tachlio @ Nov 30 2007, 08:32 AM)
yaya different class~

but still godlike
Anywhere last night u told me beside 3M tape another tape i should use is??
later i need buy it tonight will OC kaw kaw my new toy~ F3 + D9GKX
For thermal tape, 3M is the best, but even then it cannot compare with even generic thermal paste. Best of all is thermal epoxy, like Artic Alumina Adhesive, but the bond strength is ridiculously strong (thermal performance can easily rival AS5). Both share the same problem, once you put it on, its hard to take off; for epoxy its 100% impossible without special techiniques (for ram, even the 3M tape may pull off BGA chips if you're not very careful). If you don't want to cause a permanent bond, use normal thermal paste, but put a very small dab of glue at the corners of the chips. UHU glue is commonly used. Another way is suggested by artic silver, mix artic silver with the thermal adhesive/epoxy, it will not be so sticky (test on something else first though).