OK. I spent Sunday lapping my heatsink and processor to a mirror finish, just to find that my temperatures did not drop!!! So I got pissed off, and started prying off my IHS...after 30 minutes...it came off...OMG...

But it worked!

Only problem was....the temps were still THE SAME! Argh...Something must be wrong with my BIOS.

which hsf ur using? remember, u've removed the IHS, so if your using some HSF based on the stock bracket, an equivalent height of the IHS thickness on the base of the bracket should be filed off too .This brings the bracket to a 'lower' position to offset the change in the mounting height (&pressure) on the CPU. If your using bolt tru HSF mechanism, then no problem.

This is the strange part...

Before removing IHS was at 34 degrees stock speed. Now also around 32 degrees....I bought two of this chips from jian_yi's bulk a while back and my friend's processor had temps around 26 degrees! Mine with IHS off is still 32 degrees....damn weird...

1 question wat is IHS ?

dunno its stnad for wat..but its the top surface of the proc..the surface will attach to the hsf base



This post has been edited by mfcm: Sep 18 2007, 12:37 AM

Integrated Heat Spreader

Intergrated heatspreader.

thx

like i've said u got to file down the mounting ( if your using stock hsf) , u cant expect good contacts without mounting modification even tho the IHS is off. again which HSF ur using?

Actually its not that wierd, from other people's experience, there is usually minimal or NO improvement from a well lapped IHS to a removed IHS. Depends on what heatsink you're using and how well the IHS was originally mounted. Sometimes the original mounting was poor, so a large improvement can be obtained, bu this is not alway the case. Also, the processor die is much smaller than the IHS, so if the heatsink you're using doesn't do a good job of spreading heat then the benefit of having more direct heat transfer is negated.

For those using intel 775 processors, do not remove the heatspreader. There will be almost NO benefit at all as its SOLDERED to the processor die. The solder is already an exceptionally good conductor of heat, and because you might end up breaking the die/roasting the processor due to the the immense heat (about 80-120C) & pressure required to pry off the IHS. Just lap the IHS, usually the problem with 775 processors is that the IHS is not flat. For AMD 754/939/AM2 processors, it might still be feasable to remove the heatspreader (as of last notice, its bonded using only strong themal paste), but like mentioned, improvement might not be guaranteed.

In the end, its up to you to decide whether to take the risk or not.

this removal of IHS was recomended for those OC freaks.

we better stay out of this. mild OC will be as fun. happy OC-ing.

i've removed all 3 of my 939 ....3000+ 3800X2 opty170..
all 3 have improvement over IHS removed...
3-8C different...
....planning to do it with my Q6600....planning...hehee...

you sure you wanna do that? It's not the same as AMD's assembly methods. Last I checked, to remove C2D's IHS requires a blowtorch or something that high in terms of heat generation

..

i planning to heat it up with SMG solder heat blower..
i read quite a lot successful example over Xtremesystem forum...so ...i preparing...my mood...hehee

Well then good luck and all the best. Lapping my IHS was painful enough for me

...

i feel the same...i purposely bought another E2140 to replace it when i lap Q6600...only tat can make me do it slowly....slowly....i took 10-12 days separately....to lap it...everyday bout 10mins...but it doesn't gimme much improvement...pain in the *ss

I did mine in a day 4 hours straight. Temps were good tho. Full load on die at 3.2Ghz is about 55C