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 Thermal interface material, Discussions on thermal pad/paste/grease

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lohwenli
post Nov 28 2006, 08:35 AM

Penang Overclockers Club
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Joined: Aug 2006
From: Penang


QUOTE(bombman @ Nov 28 2006, 02:47 AM)
Nope, I dont
Nope. This is due to aluminium's high reactivity compared to copper. They're world's apart indeed (those who study chemistry knw dis well)
Chemically but not feasible unless u hav own lab w/ safety equipments, necessary apparatus so on.

Dilute sol (2M) of Sodium Hydroxide is normally used to clean aluminium & acetic acid for copper
*
Yup, Aluminium is on the high end of the reactive elements list, any higher, you wouldn't be able to even hold it without having something nasty happen (its used in some fireworks, FYI). On the other hand copper is on the opposite end (only gold and silver are lower). However most of us think its the other way round because aluminum forms a THIN protective layer of oxide while copper will usually keep forming an ever thicker layer of oxide, this most of us cooling freaks have clearly seen. Aluminuim oxide is unique in the sense it prevents further oxidation (think of it as instant ultra-thin laquer, and I mean ULTRA thin), cleaning it off will just encourage it to form another

About the liquid metal, it dissolves certain metals, just like water dissolves sugar. Seems in this case aluminium is our unlucky victim, not so sure about other metals. If you're crazy about the best cooling but can't get this stuff you can get then go use mercury from a thermometer (very similar, including the dissolving certain metals part).

Read this article on how 'effective' themal compound actually reduces temperatures
http://www.overclockers.com/articles662/
I'll elaborate further after some of you have read it.

One of the things that DOES have an effect is lapping an uneven IHS flat. Removing it will only noticably help if the IHS has poor contact with the CPU die (in the case of some Athlon64s), besides that its a pretty big risk. Socket 775 procs have the IHS SOLDERED on (yes, thats right) and I can say offhand that the solder will have better thermal conductivity than ANY thermal compound commonly found in the market, so stick with lapping. The finish of the lap job is not so important, but the flatness makes a big difference.

For those of you who still insist on removing a LGA775 IHS despite the insane risk,
http://www.legitreviews.com/article/402/1/
http://forums.legitreviews.com/about6779.html
http://www.digg.com/hardware/Removing_an_I...a_Propane_Torch
http://www.xtremesystems.org/forums/showth...ght=ihs+removal

You will also need to mod the mobo so your cooler can contact the now exposed die
http://www.xtremesystems.org/forums/showthread.php?t=115252

This post has been edited by lohwenli: Nov 28 2006, 08:40 AM

 

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