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gsan
post Sep 21 2013, 08:47 AM

Electrical RF Engineer
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which delid method you use? vice method? you also apply CLU in between IHS and the bare chip?
gsan
post Sep 21 2013, 05:14 PM

Electrical RF Engineer
*******
Senior Member
2,471 posts

Joined: Jan 2003
QUOTE(AceCombat @ Sep 21 2013, 08:52 AM)
I can help u delid anytime, I have all the right tools with me biggrin.gif
Anyway, yes CLU, but the temperature has a bit problem, the difference between coolest and hottest core is around 10c sweat.gif

Gonna replace it with ordinary thermal paste and see how.
*
from what I got from internet, CLU is placed in between IHS and bare chip. Then thermal paste is applied between the IHS and heatsink.

will find you on delid the proc but wait i get the CLU and good thermal paste first tongue.gif
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