luckily read this thread else really have to change to C2D

how bout removing IHS, lapped it and stick it back? btw, any idea how to stick it back?

maybe can try to remove IHS, lapped it nicely and risk free...., then put a little amount of AS5 at the core and use black epoxy to glue it back the IHS.
Wait the epoxy started to stick...then u can place the whole proc back into the socket and place back your HSF to giv it the pressure. After this, wait overnite for the epoxy to form. Then voila! u can now oc and test the temp!

Make sure you keep pressure on the IHS while the epoxy is fixing-later the thing is stuck, but there's poor thermal contact between the IHS and the CPU die (a common problem with some A64's out of the factory, which is why some OCers remove the IHS). Intel 775 chips' IHS are soldered on, so thermal contact is better (solder conducts WAYYY better than thermal compound), but Intel chips are plagued with uneven IHS (even C2D).