Feb 20 2013, 03:27 AM
QUOTE(cinkiah @ Sep 8 2012, 04:27 PM)
you use the term wrong. BGA is the method on how the chip is soldered to the board.
http://en.wikipedia.org/wiki/Ball_grid_array
on small chip like handphones you can use a heatgun. but for processor, YOU CAN'T use a heatgun for reballing process. (i dont think i need to go in details why)
*all electronics that is using BGA method is prone to broke by time. its part of big company biz plans so consumer would consume more of their product.
*the result is not the same as doing reflow, different types of solder is replaced. which is more tolerant to heat.
expect the lifespan more than 1 year.
*reballing is the ONLY method of processor repair that is suggested by microsoft, gigabyte and nvidia.
pretty sure you are not in hands on repairing line.http://en.wikipedia.org/wiki/Ball_grid_array
on small chip like handphones you can use a heatgun. but for processor, YOU CAN'T use a heatgun for reballing process. (i dont think i need to go in details why)
*all electronics that is using BGA method is prone to broke by time. its part of big company biz plans so consumer would consume more of their product.
*the result is not the same as doing reflow, different types of solder is replaced. which is more tolerant to heat.
expect the lifespan more than 1 year.
*reballing is the ONLY method of processor repair that is suggested by microsoft, gigabyte and nvidia.
reballing the ball to the bga chip with hot air gun or blower is ok and very common among experienced technicians or engineers.
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