Reballing involves in replacing the old solder joints with premade solder balls. It could be done with BGA and solder paste but i dont think it'll be advisable. It could be leaded or lead free.

Usually reballing are done with better setups and much more expensive like what u see above in his worklogs.It's foiled on all chips to prevent the infra heat from dmgin other components.

It could also be accomplish by heatguns.

But the result would most likely be the same. Once u remove the chip from the board by heat, the problem wont go away. It'll return.