The baking works more on nvid*a 8 and 9 series graphics card, because it has a known failure mechanism.

This re-baking process is called reflow in the industrial jargon. Optimum temperature is 180 for the solder melt (yes, turn to liquid). The amount of solder is little, so it won't drip. Do not exceed 210, or else the PCB internal fiberglass will melt.

Another important part is to let it cool down naturally.
It is better to have a certain amount of force pressing the GPU and the board together. Stock cooler is not recommended because force distribution is not equal.
The board should face up, unlike the photos so that the chips will sit onto the board when the solder melts.
ATI did not have this problem.

Good luck.

I think after this, oven price will increase 10%, especially the ones able to go up 200C.

My question, which heater to turn on? Both top & bottom?

What about reviving RAM stick, or CPU?