Below is how does the thermal paste seperate when I installed the S1283 vertically. I wonder that how you guy put the thermal paste when using the S1283 cooler. Normally, I put a small drop on center of the proc as what I did for few previous cooler. Somehow, I remount the cooler recently but the temperature is higher a lot than before, 3.3GHz full load @ 60~61'c with surrounding temperature 32'c in the morning. I recheck the mounting and there is nothing wrong. Maybe someone can enlighten me?
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Full Version: Xigmatek S1283 & thermal paste
IMO, You can't use the rice grain drop method on HDT technology.
Try spreading a thin layer of TIM on the IHS.
See either it perform better or worse.
But still, i don't think the rice grain drop method is useful on HDT technology.
Try spreading a thin layer of TIM on the IHS.
See either it perform better or worse.
But still, i don't think the rice grain drop method is useful on HDT technology.
QUOTE(gsan @ Mar 29 2008, 09:57 AM)
Below is how does the thermal paste seperate when I installed the S1283 vertically. I wonder that how you guy put the thermal paste when using the S1283 cooler. Normally, I put a small drop on center of the proc as what I did for few previous cooler. Somehow, I remount the cooler recently but the temperature is higher a lot than before, 3.3GHz full load @ 60~61'c with surrounding temperature 32'c in the morning. I recheck the mounting and there is nothing wrong. Maybe someone can enlighten me?
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owh, no wonder like that.........use a paper to spread the thermal paste evenly........btw, i already banked in the balance to you
I got the higher temperature with that method as well.
This is because of the drop wont be wide enough to let the heatpipe get in touch with processor IHS
Thermalpaste should be applied to all heatpipes in order to dissipate the heat faster.
This is because of the drop wont be wide enough to let the heatpipe get in touch with processor IHS
Thermalpaste should be applied to all heatpipes in order to dissipate the heat faster.
The reason why the rice grain method won't work on HDT based heatsink is because HDT tends to have some "longkang" on each side of the heatpipes, thus, it reduces the thermal transfer power.
If you use rice grain method, the TIM layer will be so thin, it won't go into those "longkang" which will result to a weaker thermal transfer.
On HDT, you need to spread the TIM all over the processor's IHS, with a lil bit more TIM on the IHS, some of the TIM will be pushed into those "longkang's".
Despite the high performance of HDT technology based heatsink, i found two weakness in HDT:
1. You can't use HDT based heatsink on naked core CPU & GPU.
2. You have to use more TIM compared to non HDT heatsink.
PS:
Sorry, i don't remember what's "longkang" in english. Sorry!
If you use rice grain method, the TIM layer will be so thin, it won't go into those "longkang" which will result to a weaker thermal transfer.
On HDT, you need to spread the TIM all over the processor's IHS, with a lil bit more TIM on the IHS, some of the TIM will be pushed into those "longkang's".
Despite the high performance of HDT technology based heatsink, i found two weakness in HDT:
1. You can't use HDT based heatsink on naked core CPU & GPU.
2. You have to use more TIM compared to non HDT heatsink.
PS:
Sorry, i don't remember what's "longkang" in english. Sorry!
QUOTE(sHawTY @ Mar 29 2008, 08:18 PM)
The reason why the rice grain method won't work on HDT based heatsink is because HDT tends to have some "longkang" on each side of the heatpipes, thus, it reduces the thermal transfer power.
If you rice grain method, the TIM layer will be so thin, it won't go into those "longkang" which will result to a weaker thermal transfer.
On HDT, you need to spread the TIM all over the processor's IHS, with a lil bit more TIM on the IHS, some of the TIM will be pushed into those "longkang's".
Despite the high performance of HDT technology based heatsink, i found two weakness in HDT:
1. You can't use HDT based heatsink on naked core CPU & GPU.
2. You have to use more TIM compared to non HDT heatsink.
PS:
Sorry, i don't remember what's "longkang" in english. Sorry!
If you rice grain method, the TIM layer will be so thin, it won't go into those "longkang" which will result to a weaker thermal transfer.
On HDT, you need to spread the TIM all over the processor's IHS, with a lil bit more TIM on the IHS, some of the TIM will be pushed into those "longkang's".
Despite the high performance of HDT technology based heatsink, i found two weakness in HDT:
1. You can't use HDT based heatsink on naked core CPU & GPU.
2. You have to use more TIM compared to non HDT heatsink.
PS:
Sorry, i don't remember what's "longkang" in english. Sorry!
lol... drain if i'm not mistaken bro...
QUOTE(AllnGap @ Mar 29 2008, 05:54 PM)
owh, no wonder like that.........use a paper to spread the thermal paste evenly........btw, i already banked in the balance to you
QUOTE(sukhoi37 @ Mar 29 2008, 08:09 PM)
I got the higher temperature with that method as well.
This is because of the drop wont be wide enough to let the heatpipe get in touch with processor IHS
Thermalpaste should be applied to all heatpipes in order to dissipate the heat faster.
This is because of the drop wont be wide enough to let the heatpipe get in touch with processor IHS
Thermalpaste should be applied to all heatpipes in order to dissipate the heat faster.
so, the thermal paste should apply evenly on the IHS only and both the IHS and the base of the s1283?
QUOTE(gsan @ Mar 30 2008, 09:19 AM)
so, the thermal paste should apply evenly on the IHS only and both the IHS and the base of the s1283?
No, but i'm not really sure the best apply method though.
I apply a thin line along the IHS (AS5 method for quadcore) then add a bit at each side of the line(this is to ensure there is thermalpaste in between the IHS and heatpipes).
QUOTE(gsan @ Mar 30 2008, 09:19 AM)
so, the thermal paste should apply evenly on the IHS only and both the IHS and the base of the s1283?
not sure about the ultimate method, but usually i'll spread it all even on the IHS, but no too thick....
this method so far considered successful as i've even removed a heatsink with AM2 proc stuck on the base(came off together when i remove the heatsink, heck, the clip is still locked)
QUOTE(AllnGap @ Apr 1 2008, 12:28 AM)
not sure about the ultimate method, but usually i'll spread it all even on the IHS, but no too thick....
this method so far considered successful as i've even removed a heatsink with AM2 proc stuck on the base(came off together when i remove the heatsink, heck, the clip is still locked)
this method so far considered successful as i've even removed a heatsink with AM2 proc stuck on the base(came off together when i remove the heatsink, heck, the clip is still locked)
this is quite often to happen when using AS5, for me though
i apply tim at each heatpipe
QUOTE(sHawTY @ Mar 29 2008, 08:18 PM)
The reason why the rice grain method won't work on HDT based heatsink is because HDT tends to have some "longkang" on each side of the heatpipes, thus, it reduces the thermal transfer power.
If you rice grain method, the TIM layer will be so thin, it won't go into those "longkang" which will result to a weaker thermal transfer.
On HDT, you need to spread the TIM all over the processor's IHS, with a lil bit more TIM on the IHS, some of the TIM will be pushed into those "longkang's".
Despite the high performance of HDT technology based heatsink, i found two weakness in HDT:
1. You can't use HDT based heatsink on naked core CPU & GPU.
2. You have to use more TIM compared to non HDT heatsink.
PS:
Sorry, i don't remember what's "longkang" in english. Sorry!
If you rice grain method, the TIM layer will be so thin, it won't go into those "longkang" which will result to a weaker thermal transfer.
On HDT, you need to spread the TIM all over the processor's IHS, with a lil bit more TIM on the IHS, some of the TIM will be pushed into those "longkang's".
Despite the high performance of HDT technology based heatsink, i found two weakness in HDT:
1. You can't use HDT based heatsink on naked core CPU & GPU.
2. You have to use more TIM compared to non HDT heatsink.
PS:
Sorry, i don't remember what's "longkang" in english. Sorry!
agreed, most of the TIMs tend to be 'pushed' to the grooves in between the HDT pipe & the alu base. Droop method isnt effective on HDT. need to spread a thin line adjacent to the pipes
QUOTE(sHawTY @ Mar 29 2008, 08:18 PM)
The reason why the rice grain method won't work on HDT based heatsink is because HDT tends to have some "longkang" on each side of the heatpipes, thus, it reduces the thermal transfer power.
If you rice grain method, the TIM layer will be so thin, it won't go into those "longkang" which will result to a weaker thermal transfer.
On HDT, you need to spread the TIM all over the processor's IHS, with a lil bit more TIM on the IHS, some of the TIM will be pushed into those "longkang's".
Despite the high performance of HDT technology based heatsink, i found two weakness in HDT:
1. You can't use HDT based heatsink on naked core CPU & GPU.
2. You have to use more TIM compared to non HDT heatsink.
PS:
Sorry, i don't remember what's "longkang" in english. Sorry!
If you rice grain method, the TIM layer will be so thin, it won't go into those "longkang" which will result to a weaker thermal transfer.
On HDT, you need to spread the TIM all over the processor's IHS, with a lil bit more TIM on the IHS, some of the TIM will be pushed into those "longkang's".
Despite the high performance of HDT technology based heatsink, i found two weakness in HDT:
1. You can't use HDT based heatsink on naked core CPU & GPU.
2. You have to use more TIM compared to non HDT heatsink.
PS:
Sorry, i don't remember what's "longkang" in english. Sorry!
What a good explanation I must say I totally agree with brother sHawTY in the ways to apply the TIM on HDT.
based on earlier discussions in ckhoong's thread, a rep from xigmatek had already explained that the best method to apply TIM on s1283 is using 'rice grain' method... even some users like kmarc 'invented' his own method in applying TIM, its not that effective than applying it normally...
therefore, i apply TIM as usual, using rice grain method... so far, no problems... it has been 8months... huhu
therefore, i apply TIM as usual, using rice grain method... so far, no problems... it has been 8months... huhu
QUOTE(Nidz @ Apr 3 2008, 11:45 PM)
based on earlier discussions in ckhoong's thread, a rep from xigmatek had already explained that the best method to apply TIM on s1283 is using 'rice grain' method... even some users like kmarc 'invented' his own method in applying TIM, its not that effective than applying it normally...
therefore, i apply TIM as usual, using rice grain method... so far, no problems... it has been 8months... huhu
therefore, i apply TIM as usual, using rice grain method... so far, no problems... it has been 8months... huhu
it should be fine if your rice grain size is big enough to cover all three heatpipes.
did you ever take the cooler out and have a look on the heatsink base?
were the TIM got contact with all the heatpipes?
I've tried the rice grain method and it doesn't work well. Like what our forumers has said, a lot of TIM will just go into the grooves. You'll find that it doesn't spread out nicely, and the side heatpipes don't get much TIM at all.
Furthermore, if you attempt to put more TIM in the middle, you'll end up with a thick paste in the middle, causing less contact....
For me, I just apply a thin line of TIM on all 3 heatpipes. Maybe a blob on the aluminium plat too. When I remove the HSF after a while, I noticed that it does cover the proc and based of the HSF evenly.....
Furthermore, if you attempt to put more TIM in the middle, you'll end up with a thick paste in the middle, causing less contact....
For me, I just apply a thin line of TIM on all 3 heatpipes. Maybe a blob on the aluminium plat too. When I remove the HSF after a while, I noticed that it does cover the proc and based of the HSF evenly.....
guys. just wanna ask. if not all of the push pins are not in place, can it affect the temp? b'coz only 3 out of 4 pins is properly secure... will my proc temp increase higher than a stock intel cooler?
QUOTE(glock88 @ Apr 10 2008, 03:40 PM)
guys. just wanna ask. if not all of the push pins are not in place, can it affect the temp? b'coz only 3 out of 4 pins is properly secure... will my proc temp increase higher than a stock intel cooler?
YES.Indeed it is hard to secure all of the 4 pin.
What should you do is take out the motherboard and fix the heatsink to the board before you put it back into the casing.
PS:
This is why most hardcore users prefer bolt through compared to push pin method.
oh then i am in trouble. i just broke the pin. haha. now i have to purchase a bolt thru kit...
QUOTE(kmarc @ Apr 7 2008, 07:40 AM)
I've tried the rice grain method and it doesn't work well. Like what our forumers has said, a lot of TIM will just go into the grooves. You'll find that it doesn't spread out nicely, and the side heatpipes don't get much TIM at all.
Furthermore, if you attempt to put more TIM in the middle, you'll end up with a thick paste in the middle, causing less contact....
For me, I just apply a thin line of TIM on all 3 heatpipes. Maybe a blob on the aluminium plat too. When I remove the HSF after a while, I noticed that it does cover the proc and based of the HSF evenly.....
Furthermore, if you attempt to put more TIM in the middle, you'll end up with a thick paste in the middle, causing less contact....
For me, I just apply a thin line of TIM on all 3 heatpipes. Maybe a blob on the aluminium plat too. When I remove the HSF after a while, I noticed that it does cover the proc and based of the HSF evenly.....
got pic? it worth billion words
QUOTE(gsan @ Apr 11 2008, 01:32 AM)
got pic? it worth billion words
So sorry... didn't take any pics..... maybe next time...
i install my bro's s1283 with tx2 using dollop method e6750.. no problem... 28C idle... no aircond
QUOTE(kmarc @ Apr 11 2008, 09:03 PM)
So sorry... didn't take any pics..... maybe next time...
self drawing pic also can
if the tim applied is too thick.. will it affect temps and maybe make it harder to remove later on? please advice me. tq
why at d beginning only d proc temp low...then after few days..temp not as 1st time installed d cooler?is't because of thermalpaste oso..?
QUOTE(glock88 @ Apr 13 2008, 09:47 PM)
if the tim applied is too thick.. will it affect temps and maybe make it harder to remove later on? please advice me. tq
Well, it'll be harder to remove, but the real problem is that too much thermal paste will make heat transfer worse (too thick). The whole idea of thermal paste is to force out air from being trapped in between the HSF and proc (air is a horribly poor conductor), however thermal paste isn't really as conductive as most people think.
QUOTE(magna_voxx @ Apr 14 2008, 11:39 AM)
why at d beginning only d proc temp low...then after few days..temp not as 1st time installed d cooler?is't because of thermalpaste oso..?
Your HSF mounting may have shifted, and the contact is not not as good as it was originally. Nothing to to with thermal paste.
How do i remove d intel thermalpaste? I'm changing to Xigmatek Red Scorpion... and I'm going to use Tuniq Tx 2.. But i can't find any cleaners available for sell.... Any ways to help me, guys?
Search for Arctic Cleaner in the CPU section....
Alcohol or spirit works well too if you're looking for a cheap alternative.
QUOTE(ysh_kobe @ Apr 15 2008, 07:25 PM)
How do i remove d intel thermalpaste? I'm changing to Xigmatek Red Scorpion... and I'm going to use Tuniq Tx 2.. But i can't find any cleaners available for sell.... Any ways to help me, guys?
Use alcohol too clean it the one we use to clean cassette deck....works for me..
QUOTE(lohwenli @ Apr 15 2008, 03:00 PM)
Your HSF mounting may have shifted, and the contact is not not as good as it was originally. Nothing to to with thermal paste.
owh,like dat eh?...tQ for d info.i think can reduce d temp a bit if use S&S kit.currently use push pin..so susah nk push tightly.
i got a question. is it possible to hit 27 degrees for cpu temp with core1 and core2 each at 40 & 41 using the s1283??? the cpu colt is 1.184V
For some reason, CPU temp and Core 1 & 2 temps are usually not the same. The only reason I can think of is that the CPU temp is from a sensor underneath the CPU (on the mobo) while the Core is the thermal diode in the CPU. That way the sensor outside will register a cooler temp than the core.
QUOTE(glock88 @ Apr 16 2008, 05:54 PM)
i got a question. is it possible to hit 27 degrees for cpu temp with core1 and core2 each at 40 & 41 using the s1283??? the cpu colt is 1.184V
why u so suprise...?my cpu temp 7-9 only..but d core reach 48-50 when i 1st installed it
QUOTE(magna_voxx @ Apr 19 2008, 11:33 PM)
why u so suprise...?my cpu temp 7-9 only..but d core reach 48-50 when i 1st installed it
huh??
bro u mean ur cpu temp is 7c-9c?? thats like almost freezing cold la... it that even possible?
7 -9 not possible rite? ambient temp in malaysia is not even close to that. how can u get that on air?
thats y im asking him... maybe he is living some where else... who knows...
QUOTE(magna_voxx @ Apr 19 2008, 11:33 PM)
why u so suprise...?my cpu temp 7-9 only..but d core reach 48-50 when i 1st installed it
There is something seriously wrong either with your sensor or the software you're using to read the temp. Or you are from somewhere really cold..like siberia..
haha true true. unless u live in somewhere like siberia where temps could go minus something 
QUOTE(ham_revilo @ Apr 20 2008, 02:24 AM)
huh??
bro u mean ur cpu temp is 7c-9c?? thats like almost freezing cold la... it that even possible?
bro u mean ur cpu temp is 7c-9c?? thats like almost freezing cold la... it that even possible?
QUOTE(glock88 @ Apr 20 2008, 08:22 PM)
7 -9 not possible rite? ambient temp in malaysia is not even close to that. how can u get that on air?
QUOTE(lohwenli @ Apr 20 2008, 09:12 PM)
There is something seriously wrong either with your sensor or the software you're using to read the temp. Or you are from somewhere really cold..like siberia..
QUOTE(glock88 @ Apr 20 2008, 11:44 PM)
haha true true. unless u live in somewhere like siberia where temps could go minus something
oi..oi...wat u guys thinking?i said d cpu temp between 7c to 9c ler.how come it become -7?haha
i'm not worry bout dat cpu temp...wat give me headache is d core temp..
bro still at 7 is almost impossible to reach on air alone. can explain how u get? with core temp at 40 i dont think so. 
can explain how u get? with core temp at 40 i dont think so.
i think is the wrong reading.... core temp at 40+ means cpu is around 30+..
dat why la...me myself dunno wat to do or wat i hv done.since pc no problm,so i don't really care...but long term,proc boley jalan.
off topic,
anyone using TX2 ? is it looks like MX2 or AS5 type? need to use artic cleaner to remove it or can direct clean with tissue?
anyone using TX2 ? is it looks like MX2 or AS5 type? need to use artic cleaner to remove it or can direct clean with tissue?
Well, I use spirit and cotton wool. Tissue alone isn't recommended, but in a pinch it won't really cause any serious problems.
QUOTE(gsan @ Apr 25 2008, 01:18 AM)
off topic,
anyone using TX2 ? is it looks like MX2 or AS5 type? need to use artic cleaner to remove it or can direct clean with tissue?
anyone using TX2 ? is it looks like MX2 or AS5 type? need to use artic cleaner to remove it or can direct clean with tissue?
i'm using tx2 and i use swan alcohol cleaner only...plus i use the make up wiper tissue (took from my wife make up case
)
QUOTE(gsan @ Apr 25 2008, 01:18 AM)
off topic,
anyone using TX2 ? is it looks like MX2 or AS5 type? need to use artic cleaner to remove it or can direct clean with tissue?
anyone using TX2 ? is it looks like MX2 or AS5 type? need to use artic cleaner to remove it or can direct clean with tissue?
if its really tough to remove u can use nail polish remover... works nicely.. but remember to clean the surface with alchohol b4 u reapply ur TIM...
Thinner also works wonders on tough removals, better than nail polish remover (aka Acetone), but like nail polish remover leaves an oily residue you must clean off with alcohol.
well, i havent try to clean my cooler base yet, but about the TIM, i'd applied to the heatpipes.. the results still the same with when i applied 100% to base surface area.. 
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